EMC’04/Sendai ABSTRACT MODELING OF SIGNAL BEHAVIOUR IN INTERCONNECTED INTEGRATED CIRCUITS BASED ON BLACK BOX APPROACH AND MODEL ORDER REDUCTION

MODELING OF SIGNAL BEHAVIOUR IN INTERCONNECTED INTEGRATED CIRCUITS BASED ON BLACK BOX APPROACH AND MODEL ORDER REDUCTION Grzegorz Lubkowski 1 , Radoslaw Piesiewicz 1 , Werner John 2 FhG IZM / University of Paderborn, Berlin/Paderborn – Germany Fraunhofer Institute for Reliability and Microintegration – Advanced Systems Engineering Technologiepark 34, 33100 Paderborn E-mail: [email protected] Abstract: This paper presents combined approach for black box modeling of Integrated Circuits (ICs) and interconnecting paths in High Density Packaged (HDP) applications. With this method numerically effective analysis and simulation of the whole (driver, interconnect, receiver) signal path is possible.